Features:
• Multi-mode operation maximizes efficiency at all loads
• New eSIP-7F and eSIP-7C packages
• Low thermal impedance junction-to-case (2 °C per watt)
• Low height is ideal for adapters where space is limited
• Simple mounting using a clip to aid low cost manufacturing
• Horizontal eSIP-7F package ideal for ultra low height adapter
and monitor applications
• Extended package creepage distance from DRAIN pin to
adjacent pin and to heat sink
• No heat sink required up to 35 W using P, G and M packages
with universal input voltage and up to 48 W at 230 VAC
Valoraciones
No hay valoraciones aún.