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Hoja de datos: STD03P.pdf
Disponibilidad: 1 disponibles
Features:
▪ Built-in temperature compensation diodes
▪ High power (160 W) handling in a small package
(TO-3P), for minimized heat sink requirements
▪ Built-in drivers and temperature compensation diodes,
reducing external component count and simplifying
circuit design
▪ NPN and PNP versions
▪ Emitter terminals placed symmetrically, pin 5 on NPN
and pin 1 on PNP models, allowing adjacent placement on
PCB to minimize trace length and output skew when used
in pairs
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